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MAX EPC Epoxy Potting Compound 4 Circuit Boards -Slow Curing & Low Exothermic 4 Large Casting, High Thermal Conductivity, Seal, Mask, Waterproof & Insulate Electrical Circuits

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Product details

Management number 215631576 Release Date 2026/04/12 List Price US$18.05 Model Number 215631576
Category

MAX EPC A/B is a room-temperature cured epoxy-based electronic potting compound designed for large mass potting or encapsulation of printed circuit boards & circuits.MAX EPC A/B is designed to cure slowly for potting large volumes, up to 44 fluid ounces or 1.3 liters. The exothermic heat produced is insufficient to produce a "runaway" reaction during cure. MAX EPC is filled with thermally conductive fillers that wick heat away and allow for faster cooling.MAX EPC A/B is mixed 4:1 by weight; it provides a 90-minute working time for volumes of 3 cubic inches & up to 45 minutes for larger mass - up to 6 cubic inches.Its mixed viscosity is 3100 cPs at 25°C, similar to the consistency of syrup or honey. It is poured into place, self-leveling, and designed to release air bubbles and cure void-free.Upon cure, MAX EPC is electrically non-conductive and provides a permanent barrier against air, corrosive environments, moisture, and direct contact with the circuitry. The high thermal conductivity prevents heat build-up by dissipating heat energy more efficiently.MAX EPC A/B bonds to metals, FRP, ABS, PVC, Plastisol, and other plastic compounds used in wire jacketing and electrical enclosures.MAX EPC is opaque black, offering permanent masking of proprietary circuits & components. MAX EPC is tough and impact-resistant, demonstrates high compressive strength, and is resistant to acids, bases, and solvents. MIX RATIO: 4:1 By WeightWORKING TIME: 90 Minutes @ 25°C CURE TIME: 48 Hrs @ 25°C ACCELERATED CURE: 2Hrs @100°CHARDNESS: 85 Shore DVOLUME RESISTIVITY: 1 x 10 exp16 Ω/CMDIELECTRIC STRENGTH: 500V/milTHERMAL CONDUCTIVITY:0.72 W/(m•K)SERVICE TEMPERATURE: -20°C to 110°C

  • Epoxy Potting Compound, Thermally Conductive For Fast Heat Dissipation
  • Large Mass, Thick Cross-Section, Low Exothermic Heat Generation
  • Lower Viscosity Compared To Other Thermally Conductive Potting Compound
  • Insulates AC/DC Current, Suitable For High And Low Voltage Insulating
  • Long Working Time - Cures In 24 Hours @ 25°C- Heat Curable For Faster Processing
Color Black
Model MAX EPC A/B 44 Ounce Kit
Volume 44 Fluid Ounces
Item Form Gel, Liquid, Paste
Viscosity 4400
Brand Name The Epoxy Experts, MAX EPOXY SYSTEMS
Unit Count 44.0 Fluid Ounces
Item Weight 5 Pounds
Manufacturer Polymer Composites, Inc.
Material Type Epoxy Resin
Container Type Bottle
Full Cure Time 48 Hours
Specific Gravity 1.57 Grams per Cubic Centimeter
Tensile Strength 9900 Pounds Per Square Inch
Compatible Material Acrylic, Ceramic, Glass, Plastic
Included Components PART A Resin, PART B Curing Agent
Item Package Quantity 1
Water Resistance Level Waterproof
Specific Uses For Product Electrical Circuit Protection, Heat Dissipation, Printed Circuit Boards
Other Special Features of the Product Electrical Insulating, For Large Volume Potting, Low Heat Exotherm For Thick Pours, Opaque Black, Thermally Conductive

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